本文在探討以有限元素法模擬與分析PBGA在經過IR-Reflow後之變形機制，並考慮PBGA各結構的塑性因子對變形的影響。而由模擬可以得到在PBGA外部如Molding Compound與Substrate與黏著在內部的Die與Die Attach的翹曲變化，並依模擬之結果對此四種結構Molding Compound、Substrate、Die與Die Attach之變形做一探討。

The main objective of this research is to studying the deformation mechanism of PBGA via IR-Reflow process by utilizing the Finite Element Method and assuming that the PBGA components are made in perfect plastic
materials.The warpage variations of the Die , Die Attach, Molding Compound,
and Substrate are discussed.

中文摘要 I
英文摘要 II
目錄 III
圖目錄 VI
表目錄 X


第一章 緒論 1
1-1 前言 1
1-2 文獻回顧 3
1-3 研究目的 9

第二章 研究方法與步驟 11
2-1 MARC / MENTAT 軟體簡介 11
2-1-1 MARC 11
2-1-2 MENTAT 12
2-2有限元素使用驗證 13
2-2-1 Bi-linear 材料模型 13
2-2-2完全塑性之材料模型 14
2-2-3 溫度負載模型 15
2-3 總結 16

第三章 PBGA有限元素模型簡介 23
3-1 元素形式 23
3-2 PBGA有限元素模型 24
3-3 PBGA之材料性質、邊界條件與負載 25

第四章 結果與討論 38
4-1 PBGA實驗量測值與模擬值 38
4-2 PBGA 之整體變形機制 40
4-3 PBGA各結構間之變形 43
4-3-1 PBGA內部Die與Die Attach之變形 43
4-3-2 Molding Compound之變形機制 46
4-3-3 Substrate之變形機制 49
4-4 各結構變形量探討 51
4-5 Die與Die Attach對PBGA變形的影響 52
4-6 總結 53

第五章 結論與展望 100
5-1 結論 100
5-2 展望 101
參考文獻 102



圖 目 錄

圖1-1(a) 半導體塑膠構裝結構(TQFP、TSOP) 10
圖1-1(b) 半導體塑膠構裝結構(PBGA) 10
圖2-1 MARC/MENTAT關係圖 17
圖2-2 E1、E2關係圖 18
圖2-3(a) 樑之塑性行為 19
圖2-3(b) 樑之變形與時間圖 19
圖2-4(a) 樑之A、B部分示意圖 20
圖2-4(b) 樑之A、B受熱後模擬結果圖 20
圖3-1 節點編號圖 27
圖3-2(a) PBGA原圖 28
圖 3-2(b) 建構之PBGA Model圖 28
圖3-3(a) PBGA之Die 1/4 全視角圖 29
圖3-3(b) PBGA之Die Attach 1/4 全視角圖 30
圖3-3(c) PBGA之Molding Compound 1/4全視角圖 31
圖3-3(d) PBGA之Substrate 1/4 全視角圖 32
圖3-4 IR-Reflow 溫度曲線圖 33
圖3-5 PBGA建構分析流程圖 34
圖4-1 PBGA對應於O、M、E、F、G、H、I、J位置處 55
圖4-2(a) 量測與模擬趨勢比較圖 56
圖4-2(b) PBGA於225℃之翹曲 57
圖4-3(a) PBGA之50℃變形圖 58
圖4-3(b) PBGA之100℃變形圖 59
圖4-3(c) PBGA之150℃變形圖 60
圖4-3(d) PBGA之175℃變形圖 61
圖4-3(e) PBGA之187℃變形圖 62
圖4-3(f) PBGA之200℃變形圖 63
圖4-3(g) PBGA之225℃變形圖 64
圖4-4(a) Die與Die Attach 於75℃變形圖 65
圖4-4(b) Die與Die Attach 於163℃變形圖 66
圖4-4(c) Die與Die Attach 於175℃變形圖 67
圖4-4(d) Die與Die Attach 於187℃變形圖 68
圖4-4(e) Die與Die Attach 於225℃變形圖 69
圖4-4(f) Die與Die Attach 變形趨勢 70
圖4-5(a) Die之E值與溫度變化圖 71
圖4-5(b) Die之CTE值與溫度變化圖 71
圖4-6(a) Molding Compound之E值與溫度變化圖 72
圖4-6(b) Molding Compound之CTE值與溫度變化圖 72
圖4-7(a) Molding Compound於75℃之變形圖 73
圖4-7(b) Molding Compound於163℃之變形圖 74
圖4-7(c) Molding Compound於175℃之變形圖 75
圖4-7(d) Molding Compound於187℃變形圖 76
圖4-7(e) Molding Compound於200℃之變形圖 77
圖4-7(f) Molding Compound於225℃之變形圖 78
圖4-7(g) Molding Compound上G、E、F三點之翹曲隨溫度變化圖 79
圖4-7(h) Molding Compound上OG、OE、OF三點中點之翹曲隨溫度變化圖 79
圖4-7(i) Molding Compound 之OG方向於不同溫度點之Z方向變形圖 80
圖4-7(j) Molding Compound 之OE方向於不同溫度點之Z方向變形圖 81
圖4-8(a) Substrate於75℃之變形圖 82
圖4-8(b) Substrate於163℃之變形圖 83
圖4-8(c) Substrate於175℃之變形圖 84
圖4-8(d) Substrate於187℃之變形圖 85
圖4-8(e) Substrate於200℃之變形圖 86
圖4-8(f) Substrate於225℃之變形圖 87
圖4-8(g) Substrate上J與H、I翹曲趨勢比較圖 88
圖4-8(h) Substrate之OJ方向於不同溫度點之Z方向變形 89
圖4-8(i) Substrate之OH方向於不同溫度點之Z方向變形 90
圖4-9(a) 沒有Die與Die Attach之PBGA於175℃之變形圖 91
圖4-9(b) 沒有Die與Die Attach之PBGA於187℃之變形圖 92
圖4-9(c) 沒有Die與Die Attach之PBGA於200℃之變形圖 93
圖4-9(d) 沒有Die與Die Attach之PBGA於225℃之變形圖 94
圖4-9(e) PBGA內部有Die與Die Attach於無Die與Die Attach在Molding Compound之M點變形趨勢比較圖 95


表 目 錄

表2-1 懸臂樑之材料性質 21
表2-2 懸臂樑之材料性質 21
表2-3(a) 懸臂樑A、B之尺寸 22
表2-3(b) 懸臂樑A、B之材料性質與溫度 22
表 3-1 PBGA尺寸 35
表3-2(a) PBGA之Die材料係數表 36
表3-2(b) PBGA之Die Attach材料係數表 36
表3-2(c) PBGA之Molding Compound材料係數表 37
表3-2(d) PBGA之Substrate材料係數表 37
表4-1(a) PBGA之Molding Compond上G點之有、無塑性行為比較 96
表4-1(b) PBGA之Substrate上J點之有、無塑性行為比較 97
表4-2 於Tg點後PBGA之各結構於Z方向變形 98
表4-3 PBGA各結構之Z方像變形變化於175~~225℃ 99

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