Title page for etd-1102114-144116


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URN etd-1102114-144116
Author Ming-Han Wang
Author's Email Address No Public.
Statistics This thesis had been viewed 5584 times. Download 2309 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2014
Semester 1
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Stress and Warpage Analyses on the 3D and 2.5D ICs with TSV Structure under Thermal and Moisture Effects
Date of Defense 2014-12-01
Page Count 130
Keyword
  • Finite element
  • Glass transition temperature
  • Vapor pressure
  • Organic passivation
  • Moisture
  • 2.5D IC Package
  • 3D IC Package
  • Abstract Polymer material tends to absorb moisture of environment to cause volume swelling among various materials of electronic package, such as underfill and substrate. The residual moisture of the package would also be vaporized into vapor phase in the reflow process. These phenomena render expansion mismatch and stress concentration at the interface between each components. If stress induced by moisture, vapor pressure and temperature up to mechanical strength, the product have the risk to damage and affect the operation.
    This paper adopt the finite element software, ANSYS v14.5, to investigate moisture diffusion and structure effects of hygro-thermal-vapor pressure coupling. This study is divided into two parts: First part is about 3D IC package. Second part is about 2.5D IC package. In 3D IC research, whether the mold compound covered and through silicon vias, micro-bumps are discussed under moisture, vapor pressure and temperature effects. In 2.5D IC research, the traditional inorganic passivation layer, Si3N4, is analyzed, in addition, the low-cost organic material is also investigated. Besides, the material properies of organic material will have a sharply change after reflow temperature up to the glass transition temperature (Tg). This paper also focus on this issue and compare the results of these two advanced package under hygro-thermal-vapor pressure coupling.
    Advisory Committee
  • Yeong-Shu Chen - chair
  • Sheng-Chih Shen - co-chair
  • Chung-Ting Wang - co-chair
  • Ben-Je Lwo - co-chair
  • Mei-Ling Wu - advisor
  • Files
  • etd-1102114-144116.pdf
  • Indicate in-campus at 2 year and off-campus access at 2 year.
    Date of Submission 2014-12-02

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