Title page for etd-0907110-115754


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URN etd-0907110-115754
Author Hua-de Gau
Author's Email Address No Public.
Statistics This thesis had been viewed 5357 times. Download 3343 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2009
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation
Date of Defense 2010-07-21
Page Count 143
Keyword
  • Gold thermosonic wire bonding
  • Finite element method
  • Copper thermosonic wire bonding
  • Thermo-mechanical coupling analysis
  • Abstract   Wire bonding has been used in integrated circuit packaging for many years which has been more full-grown than other bonding methods, and gold wire has been the preferred choice. Because of the rising price of gold every year, copper wire has been increasingly used to replace gold wire.
      The main focus of this paper is to simulate 3D copper-Al pad thermosonic wire bonding stage by using 3D finite element method. Firstly, the differences between mechanical analysis (the thermal effect was not considered) and thermo-mechanical coupling analysis from both impact stage and ultrasonic vibration stage, respectively, were compared. Secondly, the differences between copper thermosonic wire bonding analysis and gold thermosonic wire bonding analysis were discussed. Finally, the effects of Al pad thickness variation on the copper thermosonic wire bonding analysis were studied.
      Results showed that, due to the mechanical properties will be decreased by thermal effects caused from temperature increasing, the obtained effective stress and efective strain of thermo-mechanical coupling analysis were less than the results obtained from mechanical analysis. The pad plastic defomation in copper thermosonic wire bonding is more critical than gold thermosonic wire bonding. Therefore, copper thermosonic wire bonding will lead to serious pad splashing. Also, quantity of the decreasing of pad plastic deformation was limited by increasing the pad thickness.
    Advisory Committee
  • none - chair
  • none - co-chair
  • none - co-chair
  • none - co-chair
  • none - advisor
  • Files
  • etd-0907110-115754.pdf
  • indicate accessible in a year
    Date of Submission 2010-09-07

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