Title page for etd-0827108-003538


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URN etd-0827108-003538
Author Zong-Nan Jiang
Author's Email Address No Public.
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Department Electrical Engineering
Year 2007
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Design and Fabrication of High Quality-factor
Suspending Microinductors
Date of Defense 2008-07-18
Page Count 82
Keyword
  • Suspending Micro-inductor
  • Low Power Dissipation
  • High Quality Factor
  • Surface Micromachining
  • Abstract For the application of 4G wireless communication system, this thesis
    aims to develop a high-quality-factor and low-power-dissipation
    suspending micro-inductor using electrochemical deposition and surface
    micromachining technologies.
    This research presents three technical points to improve the quality
    factor and reduce the power dissipation of micro inductor, including (i) to
    adopt a low resistivity material (copper) as the conducting layer to
    decrease the Eddy current due to the skin effect and reduce the total series
    resistance and energy loss, (ii) to utilize a suspending structure to
    diminish the power loss through the substrate and (iii) to replace the
    silicon wafer with a high resistance substrate (Corning 7740) to compress
    effectively the power dissipation in high frequency operation.
    The implemented suspending micro-inductors were characterized by a
    commercial network analyzer (Agilent E5071C) under 0.5~20 GHz
    testing frequency range. All the inductances and quality factors of the
    micro-inductors proposed in this thesis are extracted by the Agilent ADS
    software. The optimized value of the quality factor is around to 24.9 and
    the corresponding inductance is equal to 5.43 nH .
    Advisory Committee
  • Jin-Chern Chiou - chair
  • Wei-Leun Fang - co-chair
  • Y.C. Lin - co-chair
  • Ruey-Shing Huang - co-chair
  • I-Yu Huang - advisor
  • Files
  • etd-0827108-003538.pdf
  • indicate in-campus access in a year and off_campus not accessible
    Date of Submission 2008-08-27

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