URN |
etd-0824111-010812 |
Author |
Rui-Ren Chen |
Author's Email Address |
No Public. |
Statistics |
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Department |
Electro-Optical Engineering |
Year |
2010 |
Semester |
2 |
Degree |
Master |
Type of Document |
|
Language |
zh-TW.Big5 Chinese |
Title |
Semiconductor Laser using Sputtered SiO2 and Quantum Well Intermixing |
Date of Defense |
2011-07-11 |
Page Count |
66 |
Keyword |
quantum well intermixing(QWI)
bandgap
thermal expansion coefficient
stress
impurity free vacancy diffusion(IFVD)
|
Abstract |
In this work , impurity free vacancy diffusion (IFVD) quantum well intermixing(QWI) technology by high thermal-expansion-induced stress is used to perform bandgap engineering. In this paper, 1530nm InGaAsP multiple QWs sandwiched by p-InP (2μm thickeneess, top) and n-InP (bottom) material is used as testing material structure also laser fabrication material, where contact materials (InGaAs and InP) on p-InP are used for comparison. By the difference between thermal expansion coefficients of SiO2 on the different material (InGaAs, InP), large different behaviors of QWI are observed, while low different dependence on defects created by ion-implantation is found. Above 70nm photo luminance (PL) wavelength shift of InGaAsP MQW below 2μm thick InP is realized in this method. Further more, CW in-plane laser structures are also successfully fabricated and demonstrated by such QWI, giving the same shift as PL. It shows that good qualify of material can be obtained in such QWI method. Using local deposition of SiO2 causes different bandgap materials, re-growth free processing for monolithic integration can be expected, offering a powerful scheme of QWI for bandgap engineering. |
Advisory Committee |
Ann-Kuo Chu - chair
Chin-Ping Yu - co-chair
Chao-Kuei Lee - co-chair
Yi-Jen Chiu - advisor
|
Files |
Indicate in-campus at 5 year and off-campus access at 5 year. |
Date of Submission |
2011-08-24 |