Title page for etd-0810114-114613


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URN etd-0810114-114613
Author Ying-chun Hou
Author's Email Address No Public.
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Department Materials and Optoelectronic Science
Year 2013
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Effect of electrolytical parameters on epitaxial growth of Ni on polycrystalline Cu
Date of Defense 2014-07-16
Page Count 152
Keyword
  • electrodeposition Ni
  • texture
  • epitaxial growth
  • EBSD
  • roughness
  • Abstract This study aimed at clarifying the effects of electroplating parameters, such as the electrolyte and pH value, and substrate roughness on the epitaxial growth of Ni on polycrystalline Cu substrates. The deposits were characterized by actomic force microscopy, scanning electron microscopy/electron backscatter diffraction and X-ray diffraction. Results indicated that no matter what texture was developed on the subsequent deposition, which was affected by the electroplating parameters, the epilayer grown on the (100) grains exhibited the greatest thickness and the lowest roughness value. Though both (111) and (100) Cu grains possessed a smooth surface after electro-polishing, the epitaxial growth on the (1111) Cu grains were clearly prohibited. Finally, the pyramid structures observed showed that the habit planes of the growth front are {100} instead of the close packed {111} planes.
    Advisory Committee
  • Der- shin Gan - chair
  • Wen-Shi Lee - co-chair
  • Pou-Yan Shen - co-chair
  • Liu-wen Chang - advisor
  • Files
  • etd-0810114-114613.pdf
  • Indicate in-campus at 5 year and off-campus access at 5 year.
    Date of Submission 2014-09-10

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