||Wafer dicing technology is one of the steps in wafer packaging. Currently sold wafer dicing machines have no measurement system of dicing forces, so that they are unable to understand the physical phenomena arising from the wafer dicing process. The present study has developed a dicing machine with the measurement system of dicing forces, including the normal, tangential force, clamping forces. A thin diamond dicing blade made by DISCO Corporation in Japan is used to dice the silicon wafer. The effects of spindle speed and feed speed on the dicing force are investigated. From the measured dicing forces and the observations of optical microscope to understand the effects of rotating speed and feed speed on the worn amount and loading phenomenon on the blade, and the damage type on material surface.|
Under different feed speeds (30、40、50、60 mm/s) and a rotating speed of 25,000 rpm, experimental results show that the dicing forces increase along with feed rate. The best feed speed is 40 mm/s, since it has minimal dicing forces, where the feed force is about 0.277 N, and the normal force is approximately 1.704 N. Moreover, under different rotating speeds (15,000、20,000、25,000、30,000 rpm) and a feed speed of 50 mm/s, results show that the dicing forces decrease along with rotating speed. The best rotating speed is 30,000 rpm with minimal dicing forces, where the feed force is about 0.5 N, and the normal force is approximately 2 N. This dicing machine can be used as the reference for the research and development of equipment in dicing IC wafer in industries.