Title page for etd-0803112-180920


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URN etd-0803112-180920
Author Han-Cheng Zou
Author's Email Address No Public.
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Department Mechanical and Electro-Mechanical Engineering
Year 2011
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Study on Selecting Package Material and Thermal Management for High Power LED Lamps
Date of Defense 2012-06-25
Page Count 81
Keyword
  • Taguchi orthogonal array method
  • FEM
  • high power LED lamps
  • Abstract Due to the improvement of luminous efficiency, LED has been applied in general lighting nowadays. However, the efficacy and life of high power LED lamps are degraded for the problem of overheat temperature of the chips. In accordance with the above reason, the thermal management has been important in LED application.
    The thesis aims to analyze the thermal problem of high power LED lamp by FEM. In the beginning, we analyzed the temperature curves and thermal stress curves of chips by changing the thickness of AuSn solder in 4 structures. According to the results, the better thickness range and structures were chosen. In the second step, the effect of different sizes of a vapor chamber on the different thermal conductivities of lamp system was discussed. Finally, we orthogonalized all the designed parameters by Taguchi orthogonal array method, and then found the optimal design by comparing the results with the initial analyses.
    In this study, we proposed a solution to improve the quality characteristics of LED lamp by Taguchi method. So the effect of each control factors on the performance was able to be determined. For different features of demand, the present study is helpful to achieve the ideal design in manufacturing.
    Key words: FEM, high power LED lamps, Taguchi orthogonal array method
    Advisory Committee
  • Shi-Pin Ho - chair
  • Jih-sheng Lo - co-chair
  • Jin-Jhy Jeng - co-chair
  • Shyue-Jian Wu - advisor
  • Files
  • etd-0803112-180920.pdf
  • Indicate in-campus at 99 year and off-campus access at 99 year.
    Date of Submission 2012-08-03

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