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URN etd-0803110-153753
Author Kuan-ling Tseng
Author's Email Address No Public.
Statistics This thesis had been viewed 5341 times. Download 4014 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2009
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Optimization of Processing Parameters for LED with Surface Mount Technology
Date of Defense 2010-07-21
Page Count 96
Keyword
  • Backlight Module
  • Reflow
  • LED
  • Optimization
  • Lead Free Solder
  • Abstract    In July 2006, the legislation of RoHS(The Restriction of the use of the Hazardous Substances in Electrical and Electronic Equipment) is fully implemented in EU. Although the major industries have response and preparedness for lead-free products, but they have no complete solution for using lead-free solder paste to replacing tin-lead solder paste. Therefore, two major issues arose in the surface mount process which are the cost increasing and the reliability decreasing of electronic products caused by higher reflow temperature. In addition to these two issue, surface mount of LED is also faced with the problem of attenuating of light intensity of LED due to the increasing of reflow temperature.
      After years, the companies of solder paste product and surface mount technology accumulate a lot of processing experience and they have certain yield on reflow process of LED.
      In order to keep competitiveness and market share, the know-how is treated as confidential. By working with about 10 professional surface mount manufacturers, it is interesting to note that solder paste and oven temperature curve used by each manufacturer are not actually the same. By adopting the experiences of cooperation with several professional surface mount manufacturers through experiments, the purpose of this thesis is to find the optimal reflow process parameters such that the light intensity loss of the LED caused by lead-free reflow process can be reduced as much as possible.
      By using Taguchi method and the executed experiments , the optimal parameter-combination have found efficiently from the four parameters: the peak of reflow temperature, the peak temperature of residence time, the brand of solder and the pre-baking time of LED. The results showed that the peak reflow temperature has the greatest influence among the selected four parameters and the following is the peak temperature residence time. The light intensity loss can be reduced up to 4-9% by adopting the obtained optimal parameters.
    Advisory Committee
  • Shiau, T. N. - chair
  • None - co-chair
  • Hsieh ,Chi-Chang - co-chair
  • Chen,Young-Chang - co-chair
  • Chien, C. H. - advisor
  • Files
  • etd-0803110-153753.pdf
  • indicate in-campus access immediately and off_campus access in a year
    Date of Submission 2010-08-03

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