| URN |
etd-0729116-014200 |
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| Author |
Wei-Chi Lee |
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| Author's Email Address |
No Public. |
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| Statistics |
This thesis had been viewed 5568 times. Download 1026 times. |
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| Department |
Mechanical and Electro-Mechanical Engineering |
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| Year |
2015 |
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| Semester |
2 |
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| Degree |
Master |
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| Type of Document |
|
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| Language |
zh-TW.Big5 Chinese |
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| Title |
The Effects of Variations of Material’s Thermal Conductivity Coefficient on Heat Dissipation of Optical Fiber Transceiver Device |
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| Date of Defense |
2016-07-08 |
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| Page Count |
119 |
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| Keyword |
optical fiber transceiver device
heat dissipation
finite volume method
design rule
thermal conductivity coefficient
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| Abstract |
As portable electronic devices have become widely used, both the demand for internet access and network traffic have increased hugely. The Optical Fiber Transceiver Device is important for communication through optical fiber networks. The temperature of the device affects its lifetime, the quality of communication and the coupling efficiency of the optical fiber.
Since some of the components of the Optical Fiber Transceiver Device can be made of various materials, this work constructs a three–dimensional Optical Fiber Transceiver Device model using the ANSYS 15.0/Fluent software for implementing the finite volume method, and to investigate the effects of the thermal conductivity coefficient of the materials on heat dissipation by the device.
Among five components which have alternative materials — substrate, housing, coating, SMT substrate and solder ball –– the results revealed the dissipation of heat by the device was dominated by the variations of substrate and SMT substrate’s thermal conductivity coefficient. These critical variables were fitted using equations in terms of the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling. The effect of the laser power on the fitting model was considered. Then, the design rule corresponding to the critical components’ thermal conductivity coefficient of the Optical Fiber Transceiver Device was obtained successfully. The errors between the simulated and the fitted results which were concluding the maximum temperature of device and the difference between the inlet and outlet temperatures of the laser coupling were less than 9%. At a heat dissipation by the laser of 210mW, when the thermal conductivity coefficients of the substrate and the SMT substrate’s material were 2W/m℃ and 60W/m℃, the maximum temperature of the device and the difference between the inlet and outlet temperatures were less than 85℃ and 12℃, respectively. |
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| Advisory Committee |
Ting-Nung Shiau - chair
Jung-Hung Sun - co-chair
Chung-Ting Wang - co-chair
Chi-Hui Chien - advisor
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| Files |
indicate access worldwide |
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| Date of Submission |
2016-08-29 |
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