Title page for etd-0728118-180645


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URN etd-0728118-180645
Author Chin-Yu Liu
Author's Email Address No Public.
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Department Electro-Optical Engineering
Year 2017
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Process Improvement For Low Loss and High Quality Ta2O5 Based Micro-ring Resonator
Date of Defense 2018-07-28
Page Count 90
Keyword
  • Waveguide
  • cavity
  • Ta2O5
  • Four-wave mixing
  • Micro-ring resonator
  • post annealing
  • Abstract In this thesis, loss optimization within Ta2O5 based micro-ring resonator was investigated. Two methods were proposed and studied. First, to reduce the absorption of N-H bond from PECVD growth SiO2 cladding laser, sputtering growth cladding was proposed. Here, using physical deposition sputter, SiO2 cladding deposition was used for avoiding absorption from N–H bonds. However, the inevitable micro-crack due to step coverage limit the loss performance. Second, by controlling the post annealing temperature and times, loss performance of the devices was investigated and improved successfully. The propagation loss of ring resonator with diameter of 100μm was reduced around 42% and with value as low as 0.44cm-1 after post annealing. The corresponding loaded and unload Q are around 52500 and 185000, respectively. Furthermore, the nonlinear applications such as four-wave mixing conversion was applied for confirming waveguide quality. Comparing to nondetective FWM signal from device before post annealing treatment, the FWM conversion efficiency of -39dB for the post annealed device has been achieved by using high quality factor Ta2O5 based micro-ring resonator at pump power of merely 4mW. This reveal the functionality of post annealing treatment for optimizing loss performance of waveguides.
    Advisory Committee
  • Yi-Jen Chiu - chair
  • Chung-Lun Wu - co-chair
  • Min-Hsiung Shih - co-chair
  • Yuan-Yao Lin - co-chair
  • Chao-Kuei Lee - advisor
  • Files
  • etd-0728118-180645.pdf
  • Indicate in-campus at 5 year and off-campus access at 5 year.
    Date of Submission 2018-08-28

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