Title page for etd-0728104-191740


[Back to Results | New Search]

URN etd-0728104-191740
Author Sheng-Shiu Yang
Author's Email Address m9138633@student.nsysu.edu.tw
Statistics This thesis had been viewed 5301 times. Download 31 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2003
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Effects of the Machining Conditions on Polishing Mechanism of Silicon Wafer for the Continuous Composite Electroplated Polisher
Date of Defense 2004-07-10
Page Count 141
Keyword
  • Polishing Mechanism
  • Silicon Wafer
  • Machining Conditions
  • Continuous Composite Electroplated
  • Abstract In the study, the effects of the machining conditions, ex, machining positions, loads and rotating speed ratio on machining mechanism of wafer are investigated by using the continuous composite electroplated polisher and find the best machining conditions of the polisher.
     Experimental results show that when the wafer and polisher are full contact, the operating of machinery is most smooth and the flatness is better. When the load is increased, the reducing rate of average roughness(Ra)and maximum roughness(Rmax), removal rate, and the speed of mirror degree are increased.
     The machining mechanism and the stability of machinery is depended on the value of rotating speed ratio. In the different rotating speed ratio, the flatness of wafer is difference. For example, the rotating speed ratio is 1, the flatness is 1.5 μm/38 mm. The rotating speed ratio is 2, the flatness is 2.3 μm/38 mm. Finally, choose the rotating speed ratio, which the values of rotating speed are close and complex on the range of rotating speed which machinery can be operating most stable in machining process. Because of the machining mechanism are similar and the grinding locus are finer. Hence, the flatness of wafer becomes better. When the rotating speed ratio is 1.1, the flatness is 1.46μm/38 mm. The rotating speed ratio is 1.11, the flatness is 1.45μm/38 mm.
     The effect of the rotating speed ratio of the wafer and polisher on the grinding locus type of grinding surface is theoretically analyzed. Results show that when the rotating speed ratio is irregular, the distribution of grinding locus becomes finer. The analyzable results of locus and provable results of experiment are the same.
    Advisory Committee
  • Jen-Fin Lin - chair
  • Yuang-Cherng Chiou - co-chair
  • Biing-Hwa Yan - co-chair
  • Rong-Tsong Lee - advisor
  • Files
  • etd-0728104-191740.pdf
  • indicate in-campus access only
    Date of Submission 2004-07-28

    [Back to Results | New Search]


    Browse | Search All Available ETDs

    If you have more questions or technical problems, please contact eThesys