URN |
etd-0727118-230340 |
Author |
Kai Chen |
Author's Email Address |
No Public. |
Statistics |
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Department |
Mechanical and Electro-Mechanical Engineering |
Year |
2018 |
Semester |
1 |
Degree |
Master |
Type of Document |
|
Language |
zh-TW.Big5 Chinese |
Title |
Development of the system for Determining the Thermal Expansion Coefficient of Thin Film |
Date of Defense |
2018-08-23 |
Page Count |
76 |
Keyword |
Test-key
pull-in voltage
empirical formula
coefficient of thermal expansion
|
Abstract |
The coefficient of thermal expansion (CTE) is the important thermal property that affects the performance of thin film components. Therefore, this study establishes a detection system for extracting the CTE which is using the electro-signal as the extracting method. The main advantage of the system is to take a fixed-fixed beam structure as the standard test-key and sequentially using the steady current to heat the test-key to perform thermal deformation and then measuring the pull-in voltage to extracting the CTE. Measuring the capacitance difference during the heating test-key process is also be done for obtaining the critical current (Icr) and the time (tst) required to reach the maximum capacitance difference, it can prevent the damage of the test-key before pull-in voltage measurement. Due to these results, the damage caused by overheating could be prevented before pull-in occurs. Finally, this study also defines the optimized experimental parameters for heating current and the range of heating time. Extracting result of the average value of the CTE of silicon is (2.58±0.04)×10-6 K-1 and only 0.77% error compared to the standard value (2.60×10-6 K-1)[1]. Therefore, the detection system can be practically applied to the production line in the future. |
Advisory Committee |
David. T.W. Lin - chair
Ching-Liang Dai - co-chair
W.C. Lin - co-chair
Wan-Chun Chuang - advisor
|
Files |
Indicate in-campus at 5 year and off-campus access at 5 year. |
Date of Submission |
2018-08-30 |