| Abstract |
The use of solving simulations using the finite element method has been developed over a long time, and mature software , such as ANSYS, MSC, Marc, and other packages, is available. Some of the software does not include enough material properties, and especially too few properties that are relate to temperature. Accordingly the results of simulations not close to the reality. The study uses the LAMMPS, which is software for simulating molecular dynamics, to simulate the experiments on the friction. The coefficient of the kinetic friction at high temperature is thus obtained. This work successfully developed a complete calculating package of coefficient of the kinetic friction. The user can change the metal and the temperature. Comparing experimental at room temperature in the literature with the results of the simulation yields a, single crystalline model error of 7.66% and a polycrystalline model error of 8.33%. This investigation discusses the effects of the frictional properties by copper on copper at various friction velocities, depth of ploughing and temperatures. In recent years, a few people have studied the polycrystalline model. In this work, not only a single crystalline model but also polycrystalline model is developed and utilized to describe the real structure of a material.
The results obtained herein yield a depth of ploughing of 2.50 nm, a simulated temperature of 293.0 K and an increase in tip velocity from 100.0 m/s to 400.0 m/s. The coefficient of kinetic friction of the single crystalline structure decreased from 2.30 to 1.24 and that of the polycrystalline structure decreased from 1.86 to 1.44. When the tip velocity is 100 m/s, temperature is 293.0 K and the depth of ploughing increased from 1.00 nm to 2.50 nm. The coefficient of kinetic friction of the single crystal structure decreased from 4.30 to 2.30 and that of the polycrystalline structure is decreased from 2.25 to 1.86. Finally, when the tip velocity is 100 m/s, the depth of ploughing is 2.50 nm and temperature increased from 293.0 K to 1000.0 K. The single crystal structure decreased from 2.30 to 1.38 and that of the polycrystalline structure is maintained between 1.77 to 1.90. |
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