Title page for etd-0727111-132910


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URN etd-0727111-132910
Author Li-Cheng Lin
Author's Email Address No Public.
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Department Mechanical and Electro-Mechanical Engineering
Year 2010
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Structural Evaluation of Wafer Level Chip Scale Package by Board Level Reliability Tests
Date of Defense 2011-07-06
Page Count 112
Keyword
  • Reliability
  • Temperature cyclic test
  • Cyclic Bending Test
  • Drop Test
  • Wafer Level Chip Scale Package
  • Abstract The Wafer Level Chip Scale Package (WLCSP) is gaining popularity for its performance and ability to meet the miniaturization requirements of portable consumer electronics, such as cell phones. For the industry of electronic package, the package life of electronic products is deemed as the essential consideration in the operation period. In practice, electronic products are usually damaged due to a harsh mechanical impact, such as drop and bending. The solder interconnections provide not only the electronic path between electric components and printing circuit board, but also the mechanical support of components on the printing circuit board, so that the reliability of solder interconnection becomes an essential consideration for a package.
    In the thesis several parameters, including redistribution layer (RDL) material and thickness, passivation material and thickness, under-bump metallization (UBM) structure factors are discussed. A variety of WLCSP structures are investigated for solder joint reliability performance. In addition to the fatigue lives of the test vehicle, locations and modes of fractured solder joints were observed.
    It was found that wafer level packaging structure under drop clearly related with the characteristic life. The weakest point of solder ball was intermetallic compound (IMC), and wafer level packaging structure was the crack into the second passivation layer and UBM interface of the corner. WLCSP under temperature cycling test was done and observed the fracture only occurred at the solder ball near the package.
    Advisory Committee
  • Cheng-Tang Pan - chair
  • Mei-Ling Wu - co-chair
  • Yi-Shao Lai - co-chair
  • Ming-Hwa R. Jen - advisor
  • Files
  • etd-0727111-132910.pdf
  • indicate in-campus access in a year and off_campus not accessible
    Date of Submission 2011-07-27

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