Title page for etd-0727106-161502


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URN etd-0727106-161502
Author Shi-Zhong Zhu
Author's Email Address No Public.
Statistics This thesis had been viewed 5357 times. Download 6568 times.
Department EMPP
Year 2005
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title The Taiwan semiconductor industry west bound research — take seals the industry as the example
Date of Defense 2006-06-16
Page Count 132
Keyword
  • SWOT Analysis
  • Abstract From year 1974 that Taiwan established the ERSO and introduce the high technology industry developing in Taiwan, it got a good result up to now, one of these high technology industry is the semiconductor industry included the Foundry and package assembly industry, these industries was leading in word, also become a model for the developing and new industry developing country. China after their revolution for opening progress that they also want to develop their high technology industry, so also included the semiconductor package assembly, and they try to copy the Taiwan success experience to China. In the past few year, because the trend of world globalization, Taiwan semiconductor package assembly industry also have some impact by this world trend, so the Taiwan semiconductor assembly industry have the idea go to west developing in China, but Taiwan government have different opinion, so from the 「No haste , be patient」、「Proactive liberalization with effective management」 change to 「Active management , effective opening」more tighten China investment policy, until to the year 2006/4/27 that Taiwan government finally agreed the semiconductor package assembly industry can be invests in China, this is why cause that want to find out the comparison between Taiwan semiconductor package assembly industry and China semiconductor assembly industry development and competitive before opening and after opening.
    This time using the Secondary Analysis Approach , that to collecting the data of the China & Taiwan, than using the SWOT Analysis Approach to compare the both sides semiconductor assembly industry internal & outside factor and also uses the Dr. Michael E. Porter diamond model 4 kinds factors (production, requirement, related industry and supporting industry) to make comparison. The analysis result is that Taiwan semiconductor assembly industries have well competition than China. After Taiwan semiconductor assembly industry go to China investing the weak point will become to a supporting.
    The conclusion is that Taiwan semiconductor assembly industry must go west to invest in China for low level product and high level product must keep in Taiwan. This kind combination is best and can create the win win policy between government and industries. This year 2005 that Taiwan semiconductor assembly industry total production amount is NT$214,000 million still world number one, but China in Year 2005 is¥34,491 million the gap become small. We expect in the near future that China semiconductor assembly industry will instead Taiwan become to world number one.
    Advisory Committee
  • Jiin-ming Fahn, - chair
  • none - co-chair
  • Diana Tsai - advisor
  • Files
  • etd-0727106-161502.pdf
  • indicate access worldwide
    Date of Submission 2006-07-27

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