Title page for etd-0726113-164741


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URN etd-0726113-164741
Author Yan-Cin Huang
Author's Email Address No Public.
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Department Materials and Optoelectronic Science
Year 2012
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Study on epitaxial growth of Ni on polycrystalline Cu and brsss by electrodeposition
Date of Defense 2013-06-26
Page Count 135
Keyword
  • epitaxial growth
  • EBSD
  • electrodeposition
  • orientation
  • Ni
  • Abstract This study investigates the effects of current density, grain orientation of polycrystalline substrate and lattice misfit on the growth behavior of Ni electrodeposited on Cu or brass substrate from a sulfamate solution. The substrate and Ni electrodeposited layer were analyzed by scanning electron microscopy, electron backscatter diffraction and transmission electron microscopy.
    Scanning electron microscopy showed that the roughness of the grain surface after electro-polishing is related to the grain orientation. The surface of the <001>//ND grains is smooth, but the <101> and <111>//ND ones are rather rough. EBSD analysis demonstrated that Ni electrodeposited initially on Cu and brass in an epitaxial manner, regardless the orientation of substrate grains and current density. At current densities of 1 A/dm2 or lower, only the epilayer deposited on the <100>//ND grains could be as thick as 1 μm, where those on grains of other orientations were thin. The thicknesses of the epilayers grown on grains of all orientations were higher than 1 μm as the current density was of 1-10 A/dm2. However, numerous small nucleus of an twin orientation relationship to the epilayer were observed on the epilayers grown on the non-<100>//ND grains. At the same electrodeposition condition and grain orientation, the critical thickness of the epilayer grown on the Cu is higher than that on brass, mainly due to a lower lattice misfit between Ni and Cu.。A transition layer of fine, equiaxed grains were observed to be positioned between the epilayer and the columnar grains. The grain boundaries in the transition layer are mainly twin boundaries.
    Advisory Committee
  • Der- shin Gan - chair
  • Jih-Jen Wu - co-chair
  • Ming-Chi Chou - co-chair
  • Liu-wen Chang - advisor
  • Files
  • etd-0726113-164741.pdf
  • Indicate in-campus at 3 year and off-campus access at 3 year.
    Date of Submission 2013-08-26

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