Title page for etd-0726105-170717


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URN etd-0726105-170717
Author Kun-Lin Sher
Author's Email Address kunlin.sher@yahoo.com.tw
Statistics This thesis had been viewed 5359 times. Download 54 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2004
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Applications of Imprint and Electroless Silver Plating on TFT Processes
Date of Defense 2005-06-20
Page Count 87
Keyword
  • Imprint
  • nanoindentation system
  • electroless silver plating
  • Abstract This study presents thin film transistor (TFT) electrode structures in flat panel displays by imprint and electroless silver plating techniques. Imprint technique
    is not limited to the physical properties of optical lithography. In the imprinting process, the glass mold designed for imprinting process is fabricated by semiconductor manufacturing technology to imprint photoresist (AZ-650). The material is evaluated for imprint process. In addition, at present, electrode
    materials used in TFT process are aluminum (Al), chromium (Cr) and so on. In other research, the thin film plating technique adopts sputtering process to manufacture TFT electrode structures. This study uses electroless silver plating process to fabricate TFT electrode structures. The experimental result shows that the silver film can be deposited on the glass wafer by electroless plating,
    The mechanical properties of the silver films such as hardness, coefficient of elasticity and Young’s module are measured by nanoindentation system,compared with the bulk materials.
    Advisory Committee
  • Chi-Hui Chien - chair
  • Yu-Rung Hsu - co-chair
  • Chien-Hsiang Chao - co-chair
  • Cheng-Tang Pan - advisor
  • Files
  • etd-0726105-170717.pdf
  • indicate in-campus access in a year and off_campus not accessible
    Date of Submission 2005-07-26

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