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URN etd-0725115-143720
Author Jia-lun Gan
Author's Email Address jialungan@gmail.com
Statistics This thesis had been viewed 5347 times. Download 1197 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2014
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Measurement of the Residual Stress in Cr-Film by Using DIC
Date of Defense 2015-07-27
Page Count 118
Keyword
  • digital image correlation
  • film thickness
  • residual stress
  • coating film
  • cantilever beam
  • Abstract In the past, if a researcher intended to measure the residual stress in a thin film coated on a substrate, the Stoney's equation was adopted and assumed that the residual stresses on the interface between film and substrate were distributed uniformity. The purpose of this thesis was to discuss the flexibility of previously mentioned uniformly distributed residual stresses assumption by investigating the distribution of residual stresses in different thickness of Cr film coated on a silicon substrate. Also, the relationship between the film thickness and the magnitude and distribution of residual stresses were studied. Firstly, a specific thickness of Cr film was coated on a cantilever beam made of silicon. Then, the residual stress can be calculated by using modified Stoney's equation and the measured out-of-plane deformation of the cantilever beam which were caused by film residual stresses. The out-of-plane deformation were measured by using digital image correlation technique with single CCD only. This thesis explored three coating thicknesses, which were 1 μm, 2 μm and 3 μm, respectively, and there were three specimens corresponded to each thickness. In order to investigate the distribution of residual stresses, the residual stresses at nine different test points on each specimen were determined. The results showed a trend that the magnitude of residual stress decreased with increasing film thickness. By combining the experimental results and statistical theory showed that the reliability of the magnitude of residual stress corresponding to 3 μm film thickness smaller than 1 μm film thickness was 86.5%. The results also showed that the residual stresses were distributed non-uniformity. The reliability of the residual stresses corresponding to 1 μm film thickness distributed more non-uniform than 3 μm film thickness was 70.98%.
    Advisory Committee
  • Ting Nung Shiau - chair
  • Jung-Hung Sun - co-chair
  • Chi-Hui Chien - advisor
  • Files
  • etd-0725115-143720.pdf
  • indicate access worldwide
    Date of Submission 2015-08-25

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