Title page for etd-0722116-143912


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URN etd-0722116-143912
Author Yu-yen Chen
Author's Email Address allen801015@gmail.com
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Department Mechanical and Electro-Mechanical Engineering
Year 2015
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Mechanical Properties Calculations for Metal IMC at Reflow Temperature – Young’s Modulus, Poisson’s Ratio and Coefficient of Thermal Expansion
Date of Defense 2016-07-08
Page Count 116
Keyword
  • first-principles method
  • Poisson’s ratio
  • Young’s modulus
  • intermetallic compound
  • coefficient of thermal expansion
  • Abstract The characteristics of the intermetallic compound in an IC package are very important. When it is too thick or non-uniformly distributed, the reliability of the IC package may be degraded. Hence, many studies have experimentally investigated or numerically simulated intermetallic compound. If one intended to use numerical simulation approach, the material properties are integral. Experimentally determining mechanical properties at high temperature is difficult and takes a long time. Therefore, in this study, density functional theory and a method based on first principles are used to build a model of various metals and intermetallic compounds and to simulate them numerically to determine their Young’s modulus, Poisson’s ratios and coefficients of thermal expansion at reflow temperature. The simulation is conducted using the software VASP and Phonopy.
    Four materials, Cu, Al, Cu3Sn and FeAl were considered. Comparing the Young’s modulus simulated results for Cu and Cu3Sn at room temperature with the relevant data in the literatures reveals errors in 10% for Cu and around 12% for Cu3Sn. The Poisson’s ratio is conformed to the reference. Experimental data at the reflow temperature of the intermetallic compound are hard to find: only the Young’s modulus of FeAl is in fact available, and the simulated error in that value is less than 1%. The coefficients of thermal expansion of Cu and Al from 300K to 600K have an error of about 10%. At 300K, the coefficient of thermal expansion of Cu3Sn has an error of 5.7% relative to experimental data. Nonlinear curve fitting also yield the temperature-dependent functions of Young’s modulus, Poisson’s ratio and coefficient of thermal expansion.
    Advisory Committee
  • Ting-Lang Hsiao - chair
  • Rung-Hung Suen - co-chair
  • Chung-Ting Wang - co-chair
  • Chi-Hui Chien - advisor
  • Files
  • etd-0722116-143912.pdf
  • indicate access worldwide
    Date of Submission 2016-08-22

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