Title page for etd-0718115-133157


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URN etd-0718115-133157
Author Bo-Wei Huang
Author's Email Address No Public.
Statistics This thesis had been viewed 5567 times. Download 11 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2014
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title A Study on the Residual Stress Estimation Formula of Blind Hole Method
Date of Defense 2015-07-23
Page Count 139
Keyword
  • least square method
  • residual stress
  • blind-hole method
  • Abstract In this study, the accuracy of blind hole method on weld residual stress estimation is investigated. A modified parameter group has also proposed to improve the accuracy. The thermal-elastic-plastic finite element model is employed to build up the residual stress distribution and the blind hole process. The Marc Finite Element software package is used to simulate the welding process and the welding residual stress and strain distributions around the weld of two inconel 690 alloy plates filled with I-52 GTAW filler. Then the process of the traditional blind hole is simulated by employing the inactive elements. The data of the residual strain variations of strain gages located around the blind hole is introduced into the blind hole method to estimate the original residual stress components at hole center. The effects of drilling depth, drilling size, gage radius, gage position and the distance on the accuracy of estimated residual stress have also been studied and discussed.
      Based on the residual stress components simulated from the welding process, a modified stress parameter group has also been proposed to improve the accuracy of blind hole method. Numerical results indicate the accuracy of estimated residual stress
    can be improved significantly by employing the proposed blind hole parameters.
    Advisory Committee
  • Ying-Chien Tsai - chair
  • Der-Min Tsay - co-chair
  • Yung-Chuan Chen - co-chair
  • Bo-wen Huang - co-chair
  • Jao-Hwa Kuang - advisor
  • Files
  • etd-0718115-133157.pdf
  • Indicate in-campus at 3 year and off-campus access at 5 year.
    Date of Submission 2015-08-18

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