| URN |
etd-0718115-133157 |
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| Author |
Bo-Wei Huang |
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| Author's Email Address |
No Public. |
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| Statistics |
This thesis had been viewed 5567 times. Download 11 times. |
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| Department |
Mechanical and Electro-Mechanical Engineering |
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| Year |
2014 |
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| Semester |
2 |
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| Degree |
Master |
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| Type of Document |
|
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| Language |
zh-TW.Big5 Chinese |
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| Title |
A Study on the Residual Stress Estimation Formula of Blind Hole Method |
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| Date of Defense |
2015-07-23 |
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| Page Count |
139 |
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| Keyword |
least square method
residual stress
blind-hole method
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| Abstract |
In this study, the accuracy of blind hole method on weld residual stress estimation is investigated. A modified parameter group has also proposed to improve the accuracy. The thermal-elastic-plastic finite element model is employed to build up the residual stress distribution and the blind hole process. The Marc Finite Element software package is used to simulate the welding process and the welding residual stress and strain distributions around the weld of two inconel 690 alloy plates filled with I-52 GTAW filler. Then the process of the traditional blind hole is simulated by employing the inactive elements. The data of the residual strain variations of strain gages located around the blind hole is introduced into the blind hole method to estimate the original residual stress components at hole center. The effects of drilling depth, drilling size, gage radius, gage position and the distance on the accuracy of estimated residual stress have also been studied and discussed.
Based on the residual stress components simulated from the welding process, a modified stress parameter group has also been proposed to improve the accuracy of blind hole method. Numerical results indicate the accuracy of estimated residual stress
can be improved significantly by employing the proposed blind hole parameters. |
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| Advisory Committee |
Ying-Chien Tsai - chair
Der-Min Tsay - co-chair
Yung-Chuan Chen - co-chair
Bo-wen Huang - co-chair
Jao-Hwa Kuang - advisor
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| Files |
Indicate in-campus at 3 year and off-campus access at 5 year. |
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| Date of Submission |
2015-08-18 |
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