||In the IC packaging industry, due to the highly maturity and reliability of wire bonding technology, it has been the most widely used method for the circuit connections. In past years, gold wire was the major material for wire bonding. However, as the price of gold continually rise, copper wire has gradually been replaced with the gold wire for the consideration of cost down. |
In this article, MD was used to study the mechanical behavior of intermetallic compounds of the Cu-Al. First, the mechanical properties of pure Cu and Al were discussed, as well as the intermetallic compound Cu9Al4, CuAl and CuAl2. In the following, Cu-Al multilayered film structures were created according to the experiment of IC wire bonding system and discussed on their structural and mechanical properties. From the results of the tensile and shear tests, the deformation will be observed at the interface, indicating that the wire bonding strength of IC package is significantly related to bonding strength of interface. Finally, the HA index and local strain distribution were used to analyze the relation between the deformation and the variation of Cu-Al atomic structure.