Title page for etd-0712114-233942


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URN etd-0712114-233942
Author Yung-Wen Wang
Author's Email Address No Public.
Statistics This thesis had been viewed 5366 times. Download 645 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2013
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Thermo-mechanical Finite Element Model in BGA Solder Joints Fatigue Life Analysis
Date of Defense 2014-07-30
Page Count 150
Keyword
  • Fatigue Life
  • Design of Experiment
  • ANOVA
  • Accumulative Strain Energy Density
  • BGA Package
  • Abstract As the microelectronic package develops technologies for fabrication smaller, faster and economical, thermal management play an important role. Temperature variation caused by either environmental changes or power consumption, and the coefficient of thermal expansion (CTE) mismatch between different packages material lead to stress and strain in package assemblies especially in solder joint. This research builds up the viscoplastic finite element model to analyze thermal-mechanical behavior of solder joint under temperature cycling loading. The finite element software ANASYS is used to calculate the accumulative strain energy density of solder joint. Furthermore, a design of experiment (DoE) with factorial analysis is used to investigate the reliability impact of the design parameters, including solder material properties and geometry. Finally, we use the analysis of variance (ANOVA) to obtain the regression model and to find out optimization factors.
    The purpose of this research is to provide a quickly experimental design assessment to improve reliability of the solder joint. The assessment model can be used to predict the accumulative strain energy density and fatigue life of the solder joint in terms of cycles to failure. The smaller plastic strain can be achieved through a better combination of material properties and geometry parameters, which is helpful of packaging design before to manufacturing.
    Advisory Committee
  • Ben-Je Lwo - chair
  • Sheng-Chih Shen - co-chair
  • Yeong-Shu Chen - co-chair
  • Mei-Ling Wu - advisor
  • Files
  • etd-0712114-233942.pdf
  • Indicate in-campus at 3 year and off-campus access at 3 year.
    Date of Submission 2014-08-27

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