Title page for etd-0710116-122048


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URN etd-0710116-122048
Author Wei-chih Chen
Author's Email Address No Public.
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Department Electrical Engineering
Year 2015
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title The Effect of Leg Geometry on Resistance and Temperature Coefficient of Resistance for Far-Infrared Ray Bolometer Device
Date of Defense 2016-07-22
Page Count 110
Keyword
  • temperature coefficient of resistance
  • sensitivity
  • microbolometer
  • lithography
  • etching
  • Abstract Pixel size scaling down of infrared microbolometer will cause reduction in its sensitivity. In this thesis, we investigate the effect of leg geometry on electrical characteristic for the device. Due to the optimal leg design, the infrared microbolometer can reduce its pixel size and maintain an excellent sensitivity simultaneously. We use MEMS processing technology with six masks to produce microbolometer device. The devices’ legs have been defined as normal leg (type A), double leg (type B), and half leg (type C) three different designs by various masks. Different device lengths from 15 um to 50 um are fabricated for each leg design. We choose device length of 30 um, 40 um, 45 um and 50 um to discuss in detail. The electrical resistance and TCR (temperature coefficient of resistance) of 12 different devices are well studied.
    In addition, we inspect key processes by optical microscope (OM) and focused ion beam (FIB) to confirm the accuracy of lithography and etching. Agilent B1500A semiconductor parameter measuring instrument is applied to measure electrical characteristic of the devices. Temperature of the samples is controlled by variable temperature system. Based on the experimental results, the resistances of most devices are several MΩ. Under the same device length, type B design has a maximum resistance. However, type A design has a maximum TCR value, which of most devices are above -2% /oC.
    As a result, type A (normal leg) design has the best performance among all designs. It has suitable resistance value, thermal isolation, and higher TCR value. Thus applying the design to pixel size reduction can optimize the sensitivity.
    Advisory Committee
  • Ying-Chung Chen - chair
  • Cheng-Fu Yang - co-chair
  • Wei-Chou Hsu - co-chair
  • Feng-Renn Juang - advisor
  • Wen-Kuan Yeh - advisor
  • Files
  • etd-0710116-122048.pdf
  • Indicate in-campus at 5 year and off-campus access at 5 year.
    Date of Submission 2016-08-10

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