Title page for etd-0706116-160726


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URN etd-0706116-160726
Author Chieh-yun Wu
Author's Email Address No Public.
Statistics This thesis had been viewed 5350 times. Download 1406 times.
Department Business Management
Year 2015
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Patent Analysis and Research of NAND Flash memory industry
Date of Defense 2016-06-30
Page Count 69
Keyword
  • Cooperative Patent Classification
  • Patent analysis
  • NAND Flash memory
  • Roadmap
  • Product Life Cycle Theory
  • Abstract In recent years, due to the Smartphone and SSD demand, manufacturers develop high-capacity, fast read, write speeds and low-cost products. Chinese manufacturers are also optimistic about NAND Flash the future development of the industry, spend a lot of money and actively expand the plant and acquisition-related industries.
    Patent analysis used in this study. Analysis software patents through M-Trends NAND Flash industry for the basic patent data analysis which use the 80/20 rule to identify major technologies and patents mainly through Cooperative Patent Classification. Through to product life cycle makes sure which the period in this industry and Roadmap for this technologies a decade of technical profile, and finally to provide advice on the development strategies for the NAND Flash vendors.
    Currently, supplies NAND Flash manufacturers are Intel, Micron, Samsung, SanDisk, SK Hynix and Toshiba. Micron is in front of the others in this industry. The results of this study a total of 11 major technologies, and the main patented a total of 26, according to industry lifecycle analysis results from maturity into decline.
    Finally, this study suggests: need for mainstream technologies development areas, selected major patent technologies do extend, new 3D NAND Flash contract price, set out to develop a hybrid memory technologies and emerging-memory technologies.
    Advisory Committee
  • Hueimei Liang - chair
  • Te-Min Chang - co-chair
  • Ping-Yi Chao - advisor
  • Files
  • etd-0706116-160726.pdf
  • indicate access worldwide
    Date of Submission 2016-08-06

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