Title page for etd-0705116-142733


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URN etd-0705116-142733
Author Yu-Ting Cheng
Author's Email Address No Public.
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Department Mechanical and Electro-Mechanical Engineering
Year 2015
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Nickel electroforming combined UV laser processing applied to through silicon via high-frequency component packaging
Date of Defense 2016-07-27
Page Count 96
Keyword
  • nickel electroforming
  • ultraviolet laser
  • through silicon via
  • taper
  • current density
  • frequency analysis
  • Abstract In this study, Nickel electroforming was integrated with 355 nm wavelength ultraviolet laser process to fabricate the through silicon via packaging. This technology was applied to package the high-frequency solidly mounted resonator (SMR). In the laser drilling experiment, the different parameters of laser power, focus length, termination diameter were set to explore the taper size of via. The silicon sample of 550 μm thickness was drilled under dynamic zoom, laser frequency at 30 kHz, laser power at 90 %, and the termination diameter at 0.05 mm. The drilling diameter of the silicon was about 110 μm where the taper was about 1.63° and the aspect ratio was about 5.
    The relationship of deposition thickness and time was obtained to electroform. The deposition thickness was calculated by current efficiency and current density and the current density was 0.5 Amps per square decimeter (ASD), 1 ASD, 2 ASD, and 4 ASD, separately. Nanoindenter, energy dispersive spectrometer (EDS), and X-ray diffraction (XRD) were used to analyze the material characteristic of electroforming samples. When the current density was lower, Young’s modulus and resistance were lower, and the grain size was lager. The deposition quality was also better than the higher current density. In the end of this study, laser drilling and electroforming were integrated to package the high-frequency SMR. Ground-signal-ground probe was used to obtain the frequency analysis. The S11 parameter was -3.5 dB where the frequency was 2.5 GHz.
    Advisory Committee
  • Ying-Chung Chen - chair
  • Zong-Hsin Liu - co-chair
  • Kuang-Kuo Wang - co-chair
  • Yong-Jheng Chen - co-chair
  • Cheng-Tang Pan - advisor
  • Files
  • etd-0705116-142733.pdf
  • Indicate in-campus at 99 year and off-campus access at 99 year.
    Date of Submission 2016-08-05

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