The purpose of this thesis is to study the electrical characteristics of ultra-thin high-k gate oxide-semiconductor interfaces. The measured samples are Y2O3/Si、Gd2O3/GaAs、Ga2O3(Gd2O3)/GaAs MOS capacitors. An accurate C-V relation has been obtained consistently by using a model that includes both series and shunt parasitic resistances. Using the semiconductor parameters and the oxide parameters, an ideal C-V curve with Dit = 0 is fitted to the accurate capacitance data, and the interface state density is deduced by Terman method. After post - metallization annealing (PMA) at 425℃, the oxide charge density, interface state density and leakage current were reduced. The results are following : (1) For Y2O3/Si MOS capacitors, we obtained a oxide charge density ~ 7.7 x 1010 cm-2, an interface state density ~ 3.6 x 1010 cm-2ev-1, and an equivalent oxide thickness ~ 52Å; (2) For Gd2O3/GaAs MOS capacitors, we obtained a oxide charge density ~ 9.8 x 1011 cm-2, an interface state density ~ 2 x 1011 cm-2ev-1, and an equivalent oxide thickness ~ 57Å; (3) For Ga2O3(Gd2O3)/GaAs MOS capacitors, we obtained a oxide charge density ~ 4.2 x 1012 cm-2, an interface state density ~ 6 x 1011 cm-2ev-1, and an equivalent oxide thickness ~ 91Å. The dielectric constants obtained from our data are smaller than the reported values. A possible explanation is that an interfacial layer formed at the oxide/semiconductor interface to reduce equivalent dielectric constant.