Title page for etd-0701103-142704


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URN etd-0701103-142704
Author Lee-Cheng Liu
Author's Email Address ec118330@ksts.seed.net.tw
Statistics This thesis had been viewed 5341 times. Download 4967 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2002
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Flip-Chip Ball Grid Array Lead Free Solder Joint under Reliability Test
Date of Defense 2003-06-10
Page Count 95
Keyword
  • Reliability Test
  • Lead-Free Solder
  • Abstract ABSTRACT
    In package, it’s easy to have defects in the solder joint, for the request of environment protection, lead-free solder research is one of the most important topics now. In soldering, the adhesion, diffusion barrier, and wettability of the interface between UBM and a lead-free solder, and the caused IMC structure that are important elements to influence long-term reliability tests. The thesis is aimed to investigate the combination of pure tin/Al-NiV-Cu UBM/STD Au substrate under reliability tests.
    The samples are bare dies in which the combination is pure tin/ Al-NiV-Cu UBM and packages of is pure tin/Al-NiV-Cu UBM/STD Au substrate. The goals are to realize the mechanical properties under multiple reflows and long term HTST tests with different temperatures and the operational life. We also uses SEM to observe the growth of IMC and the failure modes that help us to realize the connection between failure modes and IMC.
    The results of experiment can be concluded as follows. In a bare die, 260℃multiple reflows test causes delamination between IMC and die, but doesn’t affect the mechanical properties of it, and HTST test lowers the bump shear strength of it. In package, multiple reflows test and HTST test lower the mechanical properties significantly, the result also means that the adhesion between bump and die will drop significantly as tests go on. In HTOL test with the conditions of 150℃ and 320mA, the average stable service time of the package is 892 hours, and the average ultimate service time of the package is 1,053 hours, most probable failure site is in R1 joint.
    Advisory Committee
  • Shyue-Jian Wu - chair
  • Jenq-Dah Wu - co-chair
  • Huang-Kuang Kung - co-chair
  • Ming-Hwa R. Jen - advisor
  • Files
  • etd-0701103-142704.pdf
  • indicate access worldwide
    Date of Submission 2003-07-01

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