Title page for etd-0631113-193606


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URN etd-0631113-193606
Author Gen-wei Jhou
Author's Email Address No Public.
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Department Materials and Optoelectronic Science
Year 2012
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title The Study of Microstructure and Mechanical Properties of Fine-grained Cu-40%Zn Alloy Fabricated by Friction Stir ProcessingFabricated by Friction Stir Processing
Date of Defense 2013-07-23
Page Count 97
Keyword
  • friction stir processing
  • severe plastic deformation
  • Cu-Zn brass
  • electron backscattered diffraction (EBSD)
  • Abstract In this work, fine-grained Cu-40%Zn brass was produced by friction stir processing (FSP). The severe plastic deformation (SPD) and hot deformation provided by FSP could effectively refine the grains. By using proper heat treatment, two different proportions of α/β dual-phase structure were produced, which were subsequently processed by different FSP parameters to form fine-grained structure. The effect of FSP parameters on the microstructure and mechanical properties was studied. The microstructure was characterized by using transmission electron microscopy (TEM) and electron backscattered diffraction (EBSD), and both microhardness and tensile test were used to measure the mechanical properties.
    A dual-phase structure with 30% β-phase was obtained by annealing the alloy at 700oC for 1 hour and water quenching to room temperature. After FSP, the alloy contains nearly complete α-phase in all processing conditions, in which the grain size ranges from 1~6 μm. The grain size decreases as the tool rotation rate decreases or the tool transverse speed increases. An increase in FSP pass is the most effective way to refine the grain size and results in high strength. The study also indicates that a faster cooling rate in FSP could results in smaller grains by limiting grain growth.
    Advisory Committee
  • Chih-Pu Chang - chair
  • Chung-Yi Yu - co-chair
  • Po-We Kao - advisor
  • Files
  • etd-0631113-193606.pdf
  • Indicate in-campus at 5 year and off-campus access at 5 year.
    Date of Submission 2013-08-01

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