Title page for etd-0621115-133426


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URN etd-0621115-133426
Author Hao-hsiang Liu
Author's Email Address No Public.
Statistics This thesis had been viewed 5575 times. Download 434 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2014
Semester 2
Degree Master
Type of Document
Language English
Title Spray Heat Transfer with Different Nanofluids
Date of Defense 2015-07-13
Page Count 180
Keyword
  • nanofluid
  • spray cooling
  • cooling curve
  • boiling curve
  • critical heat flux
  • Abstract This study aims to establish a spray cooling system with nanofluids and investigate its heat transfer performance. In previous study of spray cooling, nozzle diameter (dj), volumetric flow rate(Q), distance(Z) between nozzle and test surface, and subcooling temperature(Tsub) and so on will influence heat transfer performance. However, in our study, foucs on heat transfer performance enhancement by nanofluids, so all of mentioned parameter above are constant, which dj is 270(μm), Q is 0.36(L/min), Z is 30(mm) and (Tsub) is 72(℃). A brass block was used as the test surface in the experiment. This study then added different nanoparticles (silver, carbon nanotube, aluminum, titanium dioxide, silicon dioxide, aluminum oxide, and ferric ferrous oxide) into the deionized water to produce the nanofluids. The nanofluids were later atomized with nozzle and sprayed on the test surface to improve the heat dissipation capability of the spray cooling system. Using steady-state method and transient method in the experiment, this study observed the boiling phenomenon when spraying the deionized water and different nanofluids with different concentration on the test surface, and recorded the temperature variation on the test surface. The results were presented in the boiling curve graph and the cooling curve graph. The ultimate objective of this study is to compare the heat dissipation performance of the nanofluids made of major nanoparticles available in the market with that of the deionized water and make an in-depth analysis, hoping the results can be applied to electronic component heat sinks and to solve the problem of rapid increase of thermal power on the electronic components’ unit areas.
    Advisory Committee
  • Chi-Hui Chien - chair
  • Cheng-Tsung Liu - co-chair
  • Mei-Ling Wu - co-chair
  • Shou-Shing Hsieh - advisor
  • Files
  • etd-0621115-133426.pdf
  • Indicate in-campus at 1 year and off-campus access at 1 year.
    Date of Submission 2015-07-22

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