Title page for etd-0620108-022417


[Back to Results | New Search]

URN etd-0620108-022417
Author Yu-Chung Lin
Author's Email Address No Public.
Statistics This thesis had been viewed 5334 times. Download 2390 times.
Department Electro-Optical Engineering
Year 2007
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title A Simple Package Technique of Light Emitting Diode for Enhancing Illuminant Quality
Date of Defense 2008-06-11
Page Count 86
Keyword
  • Package
  • Light Emitting Diode
  • led
  • Abstract The purpose of this thesis is to fabricate an LED module with low half intensity angle(HIA) ,and to use this module to form a line source with optical performance comparable to that of a CCFL .In addition ,heat dissipation of the LED module on different sub-mounts is also investigated .
    The LED modules were formed by first etching a through si via on silicon substrate using wet etching technology for light confining .Then a thin layer of metal was deposited on to the via to reflect the lights emitted from the LED .The LED die was attached to the Si sub-mount with electrodes ,and the connections between the LED and the Si sub-mount were completed by wire bonding .Finally ,the LED modules were obtained by positioning the Si substrates onto the Si sub-mounts using UV epoxy .
    The optical performance of the LED module was simulated by Lighttools .For the si substrate with a thickness of 400 μm ,a simulated HIA of 36 o was obtained .Using six-LED package ,a 3-cm line source with 84.8% output uniformity was simulated .On the other hand ,the measured HIA of a LED module ,and the uniformity of 3-cm line source are 38 o and 84.8% ,respectively.
    The thermal resistance of the si sub-mounts were also investigated .The different structures of the sub-mount were proposed ,namely ,LED to Copper case ,LED to Si sub-mount to Copper case ,and LED to Si sub-mount with Copper filled via to Copper case .The estimated thermal resistance of the sub-mounts are 13 W/mk、19.4 W/mk and 34.7 W/mk .We believe that the large thermal resistance of the Si sub-mount with Copper filled via is primarily caused by 800 μm thick substrate .
    Advisory Committee
  • Ting-Chang Chang - chair
  • Mei-Ying CHang - co-chair
  • Yi-Jen Chiu - co-chair
  • Ann-Kuo Chu - advisor
  • Files
  • etd-0620108-022417.pdf
  • indicate in-campus access immediately and off_campus access in a year
    Date of Submission 2008-06-20

    [Back to Results | New Search]


    Browse | Search All Available ETDs

    If you have more questions or technical problems, please contact eThesys