Title page for etd-0617117-153343


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URN etd-0617117-153343
Author Cheng-Yu Tsai
Author's Email Address No Public.
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Department Mechanical and Electro-Mechanical Engineering
Year 2016
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Effect of Thermal Interface Material in High-performance Flip Chip Ball Grid Array package on Heat Transfer Efficiency
Date of Defense 2017-06-29
Page Count 95
Keyword
  • multi-point measurement
  • thermal resistance
  • HFCBGA
  • Taguchi
  • HTST
  • Abstract The purpose of this study is to investigate the heat transfer ability of high-performance flip-chip ball grid array (HFCBGA) package. In this work, the value of junction-to-case thermal resistance (θJC) is the important index to judge thermal performance. In electronic package, thermal interface material(TIM) always plays an important role in thermal capability, and its thermal conductivity, thickness and coverage will be the dominant factors on heat transfer efficiency. Another objective is to make sure the value of thermal resistance lower than that of product standard. 
      This study can be divided into four parts:First of all, thermal conductivity of TIM was measured, then the different junction temperature and case temperature from different positions using multi-point measurement method after calibration were measured later. With the value of temperature and power, the θJC were calculated. Second part was to building a verified model using FloTHERM solfware to simulate the temperature of each position on chip according to the experimental value of θJC and voids、delamination and distribution of TIM in image of C-SAT. Third part is to focus on test samples after HTST for 200 and 500 cycles, both of the experimental θJC values of the samples should be close to simulated values by the verified model. Finally, Taguchi method and ANOVA were adopted to analyze each factor of θJC to obtain the possibly best design.
      The deviation between measurement and simulation on the highest value of θJC was lower than 5%. Taguchi method L18(21×37) orthogonal array was used to simulate each combination with 8 factors, then using ANOVA to find out that the higher thermal conductivity of die-attach, larger die size and thinner die-attach were the efficient ways to make HFCBGA package of better thermal performance.
    Advisory Committee
  • Ming Chen - chair
  • Tang-Yuan Chen - co-chair
  • Huang-Guang Gong - co-chair
  • Ming-Hwa R.Jen - advisor
  • Files
  • etd-0617117-153343.pdf
  • Indicate in-campus at 0 year and off-campus access at 2 year.
    Date of Submission 2017-07-19

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