Title page for etd-0617115-004624


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URN etd-0617115-004624
Author Yi-Jhe Chen
Author's Email Address No Public.
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Department Electro-Optical Engineering
Year 2014
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Heterogeneous III-V/silicon integrated Spot Size Converter
Date of Defense 2015-06-23
Page Count 84
Keyword
  • Spot size converter
  • heterogeneous integration
  • undercut
  • self-aligned
  • resonant coupling method
  • Abstract High-efficiency optical spot size converter (SSC) has become one of the major functional elements in photonics integration. Due to low-loss conversion, the optical fields of waveguide devices can be transferred either from layer to layer, or from device to device, enabling the integration of individual device function advantages and also their optical interconnection.
    In this work, a new type of SSC has been proposed and demonstrated based on hybrid integration of III-V and Si material. Using tapered III-V waveguide integrated with Si waveguide, the optical field modes can be converted in a short distance through resonance condition. The mode field can also be locked after conversion due to the enlarged waveguide structure. During the processing, DVS-BCB was used as adhesive material to bond two wafers. Selective undercut etching with self-alignment technique was then performed to fabricated tapered waveguide structure of directional coupler. By numerical simulation, 95% of mode conversion can be attained between Silicon on insulator (SOI) waveguide and III-V waveguide. A single mode SOI with 0.7μm width and 0.22μm height has been successfully integrated with top tapered submicron III-V waveguide through wafer bonding technology. By comparing with different length of SOI and III-V waveguide, 80% conversion efficiency was found.
    Advisory Committee
  • Shoou-Jinn Chang - chair
  • An-Kuo Chu - co-chair
  • Chao-Kuei Lee - co-chair
  • Wei Lin - co-chair
  • Yi-Jen Chiu - advisor
  • Files
  • etd-0617115-004624.pdf
  • Indicate in-campus at 5 year and off-campus access at 5 year.
    Date of Submission 2015-07-17

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