Title page for etd-0617113-213541


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URN etd-0617113-213541
Author Sheng-Han Xie
Author's Email Address No Public.
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Department Electrical Engineering
Year 2012
Semester 2
Degree Master
Type of Document
Language English
Title Tearing off and bonding semiconductors
Date of Defense 2013-07-11
Page Count 44
Keyword
  • SLiM-Cut
  • thermal stress
  • silicon foil
  • Abstract Silicon solar cell made from thin-film crystalline-silicon layers on glass substrates could lower the price of photovoltaic electricity substantially. For this reason, a considerable number of methods have been proposed in the last decade to manufacture thin silicon foils which aim to replace the commonly used sawing technique. One of these methods ”SLiM-Cut” is based on peeling off a thin layer from a silicon substrate by means of the thermal stress induced by layers deposited on the silicon. Up to now, three different materials which are used to be deposited layers have been successfully employed in this technique: Nickel, Nickel/Chromium alloy and a Silver/Aluminium system. In this work we invent the possibility to induce the lift-off of a thin silicon solar cell foil by means of smearing small region Ag paste on top of the solar cell. This new method has low cost and lowers the operating temperatures.
    Advisory Committee
  • Y.C. Chen - chair
  • Da-Ren Hang - co-chair
  • Yeong-Her Wang - co-chair
  • IKai Lo - co-chair
  • Ming-Kwei Lee - advisor
  • Ying-Chung Chen - advisor
  • Files
  • etd-0617113-213541.pdf
  • Indicate in-campus at 99 year and off-campus access at 99 year.
    Date of Submission 2013-07-17

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