Title page for etd-0608114-140456


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URN etd-0608114-140456
Author Ming-Ru Tang
Author's Email Address No Public.
Statistics This thesis had been viewed 5569 times. Download 75 times.
Department Electrical Engineering
Year 2013
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Emission Enhancement in Ag/SiO2/Ag Infrared Thermal Emitter by Using a Hexagonal Dimple Array
Date of Defense 2014-06-21
Page Count 52
Keyword
  • Dimple structure
  • Dual E-Beam Evaporation
  • Sputter
  • Surface plasmon
  • Thermal emitter
  • Abstract In this letter presents the effect of surface plasmon polaritons (SPPs) and ap-plied to thermal emitter. First, the sample Ag/SiO2/Ag plasmonic thermal emitter (ASA-PTE) were fabricated by using photolithography and evaporation proce-dures. There have three different designed. Different thickness of Ag film (10, 11, 15 and 18 nm). The dimple Ag film (a = 3, 5 μm, D = 2μm, L = 2μm) or not. Different thickness of SiO2 cavity (100, 520, 900 and 2000 nm). Analyzed SPPs by the emittance and efficiency. The thermal emission spectra and dispersion relations of reflection spectra are measured by Perkin Elmer 2000 Fourier Transfer Infrared (FTIR) and Bruker IFS 66 v/s FTIR. We designed 10 nm to 15 nm dimple Ag coupling layer and enhance the emission intensity. When the size a = 3μm, D = 2μm, heating temperature 100℃, 150℃ and 200℃, the emission power are 22.4 mW/cm2, 31.2 mW/cm2 and 42.3 mW/cm2 respectively. And the size a = 5 μm, L=2μm, heating temperature 100℃, 150℃ and 200℃, the emis-sion power are up to 43.2 mW/cm2, 63.4 mW/cm2 and 79.3 mW/cm2 respec-tively. Prove that the surface plasmons can efficiently applied to thermal emit-ter. The future work is combine with Biomedical application.
    Advisory Committee
  • Lung-Chien Chen - chair
  • Wei-Chen Tu - co-chair
  • Mu-Jen Lai - co-chair
  • Yi-Tsung Chang - advisor
  • Jyi-Tsong Lin - advisor
  • Files
  • etd-0608114-140456.pdf
  • Indicate in-campus at 5 year and off-campus access at 5 year.
    Date of Submission 2014-07-08

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