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|Type of Document
||Design of Millimeter Wave QFN Package using Defected Ground Structure Technique|
|Date of Defense
T-Line with a DGS
||This thesis includes five chapters.|
Chapter I, background and motivation in this thesis are introduced.
Chapter II addresses IC package characteristics and the interface between chip and
package at millimeter-wave frequencies. We review several advanced packages and
their interconnections processes, including Flip-chip, MicroCoax and TSV (Through
Silicon Via) etc. Also briefly described are advantages, disadvantages and technology
challenges of these packages at high frequencies.
Chapter III focuses on QFN (Quad Flatpack No-leads) package and its signal
integrity at millimeter-wave frequencies. First of at all, we investigated parasitic
inductance of wire-bond and its skin effect. Then, we compare the transmission
characteristics of Round-wire and Ribbon-wire in QFN package. We also compare
different bonding configurations and its impacts on transmission characteristic. Since
de-embedding are needed to analyze the discontinuities, they are introduced accordingly.
Chapter IV uses a defected ground structure (DGS) transmission line (T-Line) in
QFN’s structure to extend its operation bandwidth. To begin with, transmission line
with a DGS is studied. Then, we are using the transmission line - DGS to achieve best
transmission matching characteristics. Finally, we fabricated and validated our method
through measurement results. The measurement result shows of QFN package has S21
below -1.5 dB at 61.6 GHz and S11 better than -10 dB at 65.6 GHz. The QFN packages
can be operated up to 61 GHz.
Chapter V conclusions and future work are given.
||Ken-Huang Lin - chair|
Chih-Wen Kuo - co-chair
Lih-Tyng Hwang - advisor
Indicate in-campus at 99 year and off-campus access at 99 year.|
|Date of Submission