Title page for etd-0602113-164637


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URN etd-0602113-164637
Author Wen-Hsian Lee
Author's Email Address No Public.
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Department Communications Engineering
Year 2012
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title Design of Millimeter Wave QFN Package using Defected Ground Structure Technique
Date of Defense 2013-06-20
Page Count 96
Keyword
  • QFN
  • T-Line with a DGS
  • Ribbon-bond
  • Impedance Matching
  • Abstract This thesis includes five chapters.
    Chapter I, background and motivation in this thesis are introduced.
    Chapter II addresses IC package characteristics and the interface between chip and
    package at millimeter-wave frequencies. We review several advanced packages and
    their interconnections processes, including Flip-chip, MicroCoax and TSV (Through
    Silicon Via) etc. Also briefly described are advantages, disadvantages and technology
    challenges of these packages at high frequencies.
    Chapter III focuses on QFN (Quad Flatpack No-leads) package and its signal
    integrity at millimeter-wave frequencies. First of at all, we investigated parasitic
    inductance of wire-bond and its skin effect. Then, we compare the transmission
    characteristics of Round-wire and Ribbon-wire in QFN package. We also compare
    different bonding configurations and its impacts on transmission characteristic. Since
    de-embedding are needed to analyze the discontinuities, they are introduced accordingly.
    Chapter IV uses a defected ground structure (DGS) transmission line (T-Line) in
    QFN’s structure to extend its operation bandwidth. To begin with, transmission line
    with a DGS is studied. Then, we are using the transmission line - DGS to achieve best
    transmission matching characteristics. Finally, we fabricated and validated our method
    through measurement results. The measurement result shows of QFN package has S21
    below -1.5 dB at 61.6 GHz and S11 better than -10 dB at 65.6 GHz. The QFN packages
    can be operated up to 61 GHz.
    Chapter V conclusions and future work are given.
    Advisory Committee
  • Ken-Huang Lin - chair
  • Chih-Wen Kuo - co-chair
  • Lih-Tyng Hwang - advisor
  • Files
  • etd-0602113-164637.pdf
  • Indicate in-campus at 99 year and off-campus access at 99 year.
    Date of Submission 2013-07-02

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