Title page for etd-0520116-103104


[Back to Results | New Search]

URN etd-0520116-103104
Author Jen-Kuang Fang
Author's Email Address No Public.
Statistics This thesis had been viewed 5749 times. Download 3004 times.
Department EMBA
Year 2015
Semester 2
Degree Master
Type of Document
Language zh-TW.Big5 Chinese
Title A Study on Key Success Factors for New Product Development of Semiconductor IC Assembly and Test Industries
Date of Defense 2016-06-04
Page Count 132
Keyword
  • Semiconductor IC assembly and test industries
  • Success factors for new product development
  • APQP
  • ASE Group
  • Competitive strategy advantage
  • Abstract This report focus on key success factors for new product development of semiconductor IC assembly and test industries. These factors include new technology developments, supply chain linkages, customer and marketing informations, and strategic alliance from different business fields, etc. Motivation can strengthen the Taiwan IC industry's competitiveness. For the semiconductor IC packaging and testing industry, this analysis model constructed and experiences both have considerable values. So that, this analysis model provides the basis for further study and contributes to integrate the heterogeneous enterprises for expanding with the industries. According to the study results, these findings also can extend to other industries.
    As discussed in this study, the literature indicates competitive strategic advantages of the most successful companies. Then, research laboratory generalize all to design a specific key success factors analysis mode. Firstly, observe the status and future development trend of the global semiconductor IC (Integrated Circuit) packaging and testing industry. From that, we learned the basic conditions of the competitive strategic advantage and key technologies from analysis processes. Furthermore, ASE Group is selected as the case study because it is one of the most successful and representative companies in related industries. In this study, secondary data compilation expertise gleaned by interviews and informations disclosed to the public. The study model reviews all important objects and processes accomplished for new product development with APQP (Advanced Product Quality Planning) itemized. From the substantive case analyses, this study summes up the key success factors of the semiconductor IC packaging and testing industry in the development of new products.
    The analysis results expect: new product success or failure is decided with these important keys including the planning completeness for product development, processes of implementation and competitive strategy advantages of industry. The results also can point out the constraints faced and companies with what kind of styles in future research. Therefore, this report can try to take the social responsibility of giving back to society. And, it may be due to findings accurately and then reduces the unnecessary human waste.
    Advisory Committee
  • Tsai, Hsien-tang - chair
  • Chao-Cheng Chung - co-chair
  • Cher -Min Fong - advisor
  • Cher-Hung Tseng - advisor
  • Files
  • etd-0520116-103104.pdf
  • indicate access worldwide
    Date of Submission 2016-07-05

    [Back to Results | New Search]


    Browse | Search All Available ETDs

    If you have more questions or technical problems, please contact eThesys