Title page for etd-0212104-204052


[Back to Results | New Search]

URN etd-0212104-204052
Author Chin-chiang Liu
Author's Email Address johnsoncc_liu@aseglobal.com
Statistics This thesis had been viewed 5343 times. Download 11208 times.
Department Mechanical and Electro-Mechanical Engineering
Year 2003
Semester 1
Degree Master
Type of Document
Language English
Title Reliability Improvement for Lead Free UltraCSP
Date of Defense 2004-01-13
Page Count 70
Keyword
  • lead free
  • sem
  • reliability
  • ultracsp
  • Abstract 1.Sn/Ag4.0/Cu0.5 solder with better performance by the improved reflow profile.
    2.The Sn/Ag2.6/Cu0.6、Sn/Ag4.0/Cu0.5 with similar reliability test performance.
    Advisory Committee
  • Chau-Chang Wang - chair
  • Cheng-Yi Chen - co-chair
  • Chi-Cheng Cheng - advisor
  • Files
  • etd-0212104-204052.pdf
  • indicate access worldwide
    Date of Submission 2004-02-12

    [Back to Results | New Search]


    Browse | Search All Available ETDs

    If you have more questions or technical problems, please contact eThesys